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ASM International NV (ASMXF)

NEUTRAL
TechnologySemiconductor Equipment & MaterialsNetherlands

基本面

61

价格

$828.20

市值

$40.88B

第一部分 · 这家公司值多少

概览

ASM International makes the specialized machines that deposit ultra-thin layers of material onto silicon wafers, one atomic layer at a time — a step semiconductor manufacturers need to build the smallest, most advanced chips. Its core technology is atomic layer deposition (ALD), where it holds a leading market share, alongside epitaxy tools used for advanced logic and memory chips. Customers are the world's largest chipmakers building next-generation processors, including the leading-edge nodes used for AI chips.

盈利方式

ASM sells deposition equipment as capital goods: a customer buys or upgrades a tool as part of a new fab or process node, then keeps buying spare parts and service for years afterward. Because chipmakers only invest in new nodes when they expect strong demand, ASM's order book swings with the broader semiconductor capital-spending cycle. In 2025, demand for the newest 2-nanometer logic technology drove a record year, while memory-chip customers bought less than usual.

分部营收

Logic/Foundry84%

Deposition equipment sold to makers of logic and foundry chips, including customers building the most advanced 2-nanometer process nodes.

Memory16%

Equipment sold to memory-chip manufacturers, including tools for high-bandwidth DRAM; sales here fell back in 2025 after unusually strong 2024 demand from China.

护城河

专利与许可 · 狭窄

ASM holds a leading share, reported above 55% in the markets it competes in, of atomic layer deposition — a process step increasingly required as chipmakers shrink transistors further. That lead rests on patented process know-how built over decades rather than on customer switching costs, and rival equipment makers are investing to close the gap as ALD becomes more central to chipmaking.

需求驱动因素

周期性

Orders depend on how much the handful of major chipmakers plan to spend on new factories and process nodes, a decision driven by their own demand forecasts for chips — famously volatile in itself. A wave of AI-driven investment in advanced nodes can be followed by a pause once that capacity is built, as ASM's swing between strong logic demand and weak memory demand in 2025 illustrates.

看多理由

Buyers argue that ASM's leadership in atomic layer deposition positions it to capture a growing share of each new chip factory's equipment budget as transistors keep shrinking, and that 2025's record revenue shows this demand is already materializing around advanced AI chip production.

看空理由

Sellers fear that ASM's revenue is tied to a small number of customers' capital-spending decisions, that memory-chip orders can swing sharply from one year to the next as 2025 showed, and that competitors are investing to erode its lead in deposition technology.

Written by the editors, published on 2026年8月18日

Direct competitors

Who this company fights with for the same customers

Compare

Generated on 2026年8月23日 with claude-opus-5 — shared with all users

P/E: 41.8Score: 72Market cap: $384.25B

The world's largest wafer-processing equipment maker sells competing ALD, CVD and epitaxy deposition tools to the same logic and memory chipmakers ASM serves.

P/E: 53.8Score: 75Market cap: $388.12B

Lam's deposition line, built on the Novellus business, bids for the same CVD and ALD process steps in advanced logic and 3D NAND fabs.

Tokyo Electron Limited (東京エレクトロン株式会社)8035.T

Tokyo Electron competes head-on in single-wafer and batch ALD and in thermal processing furnaces, and is investing to take share in the ALD steps where ASM leads.

Kokusai Electric Corporation (株式会社Kokusai Electric)6525.T

Kokusai is the leader in batch ALD and vertical furnaces, the exact segment where ASM's furnace and batch deposition tools compete, above all at memory makers.

Wonik IPS Co., Ltd. (원익아이피에스)240810.KQ

The Korean toolmaker supplies ALD and PECVD deposition equipment qualified at Samsung and SK Hynix, competing with ASM for the same Korean memory budgets.

Jusung Engineering Co., Ltd. (주성엔지니어링)036930.KQ

Jusung specializes in ALD deposition tools sold to Korean DRAM makers, taking on ASM in the specific ALD steps of memory production.

资产负债表与流动性

营收

$3.34B

截至最近已公布季度的最近12个月 — 根据每股指标估算

净利润

$1.07B

截至最近已公布季度的最近12个月 — 根据每股指标估算

自由现金流

$235M

股东权益合计

$4.45B

负债合计

$71M

流动比率

2.17

利息覆盖率

-

债务/EBITDA

0.06

每股收益

营收与净利润

自由现金流

收入构成

历史财务表

利润率变化

债务变化

债务负担有多重

增长一览表

增长 — 营业收入

公允价值估算

合理估值

公允价值

$713.28

当前价格

$828.20

安全边际

-16.1%

公允价值区间

$463.63 - $962.92

估算方法

Analyst Target:$1113.26
DCF:$78.42
PE-based:$863.60
Graham Growth:$952.12
EPV:$111.37
分析师共识:买入 (20B / 4H / 1S)
最近财报超预期:+15.23%

估值指标

市盈率(P/E)

37.61

ROE

26.8%

市净率(P/B)

10.04

P/FCF

173.75

毛利率

51.8%

ROIC

18.9%

盈利能力雷达图

Value Creation (Economic Moat)

ROIC

18.9%

WACC

17.1%

ROIC − WACC

+1.8 pp

ROIC exceeds the cost of capital — the company is creating value for shareholders.

基本面分析标准

通过(14)

  • Price CAGR 33.67%
  • ROIC 18.9%
  • Gross Margin 51.8%
  • Debt/Equity ratio
  • Operating Margin 35.4%
  • Positive Free Cash Flow
  • Current Ratio
  • Debt/EBITDA
  • ROE 19.2%
  • Revenue Growth 5Y 19.0%
  • Analyst Consensus 80% Buy
  • Earnings Surprise avg 17.2%
  • PEG Ratio 1.98
  • Earnings Quality (OCF/NI) 1.36

未通过(7)

  • P/FCF 173.75
  • P/B Ratio 10.04
  • CapEx intensity
  • Price below Graham Number
  • DCF valuation (Overvalued)
  • Net Margin Trend 22.8% vs 23.4%
  • Piotroski F-Score 2/9

不可用(6)

  • EPS data insufficient
  • Dividend Payout NaN%
  • Interest Coverage
  • Return on Tangible Assets
  • Low reliance on intangibles
  • Share Dilution (missing shares data)

Piotroski F-评分

2/9

存在严重财务隐患

score
criteria

盈利质量

1.36

高质量:盈利有现金流支撑

股权稀释

-

正在回购股份,对股东友好

公司治理

管理团队

姓名职位年龄
Dr. Hichem M'SaadCEO & Chairman of the Management Board60
Mr. Paulus Antonius Henricus VerhagenCFO & Member of Management Board59
Mr. Hakan ErdemirSenior Vice President of Global Operations57
Mr. Victor BareñoDirector of Investor Relations-
Mr. Srini VedulaSenior Vice President of Global Sales53
Ms. Edyta JakubekSenior VP of Global People & Chief People Officer51
Gary DingChief Product Officer63
Paul MaCorporate VP, Head of Strategy and M&A49

审计风险

1

董事会风险

1

薪酬风险

2

股东权利风险

6

第二部分 · 价格与买入时机

这一部分不判断公司是否值得拥有:它帮助你在基本面说服你之后,选择何时买入。包含:技术分析、潜力、历史回撤、Gamma 敞口。

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