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ASM International NV (ASMXF)

NEUTRAL
TechnologySemiconductor Equipment & MaterialsNetherlands

ファンダメンタル

61

株価

$828.20

時価総額

$40.88B

パート1 · 企業の価値

概要

ASM International makes the specialized machines that deposit ultra-thin layers of material onto silicon wafers, one atomic layer at a time — a step semiconductor manufacturers need to build the smallest, most advanced chips. Its core technology is atomic layer deposition (ALD), where it holds a leading market share, alongside epitaxy tools used for advanced logic and memory chips. Customers are the world's largest chipmakers building next-generation processors, including the leading-edge nodes used for AI chips.

収益の仕組み

ASM sells deposition equipment as capital goods: a customer buys or upgrades a tool as part of a new fab or process node, then keeps buying spare parts and service for years afterward. Because chipmakers only invest in new nodes when they expect strong demand, ASM's order book swings with the broader semiconductor capital-spending cycle. In 2025, demand for the newest 2-nanometer logic technology drove a record year, while memory-chip customers bought less than usual.

セグメント別売上高

Logic/Foundry84%

Deposition equipment sold to makers of logic and foundry chips, including customers building the most advanced 2-nanometer process nodes.

Memory16%

Equipment sold to memory-chip manufacturers, including tools for high-bandwidth DRAM; sales here fell back in 2025 after unusually strong 2024 demand from China.

競争優位性(moat)

特許・ライセンス · 狭い

ASM holds a leading share, reported above 55% in the markets it competes in, of atomic layer deposition — a process step increasingly required as chipmakers shrink transistors further. That lead rests on patented process know-how built over decades rather than on customer switching costs, and rival equipment makers are investing to close the gap as ALD becomes more central to chipmaking.

需要を左右する要因

景気循環型

Orders depend on how much the handful of major chipmakers plan to spend on new factories and process nodes, a decision driven by their own demand forecasts for chips — famously volatile in itself. A wave of AI-driven investment in advanced nodes can be followed by a pause once that capacity is built, as ASM's swing between strong logic demand and weak memory demand in 2025 illustrates.

強気材料

Buyers argue that ASM's leadership in atomic layer deposition positions it to capture a growing share of each new chip factory's equipment budget as transistors keep shrinking, and that 2025's record revenue shows this demand is already materializing around advanced AI chip production.

弱気材料

Sellers fear that ASM's revenue is tied to a small number of customers' capital-spending decisions, that memory-chip orders can swing sharply from one year to the next as 2025 showed, and that competitors are investing to erode its lead in deposition technology.

Written by the editors, published on 2026年8月18日

Direct competitors

Who this company fights with for the same customers

Compare

Generated on 2026年8月23日 with claude-opus-5 — shared with all users

P/E: 41.8Score: 72Market cap: $384.25B

The world's largest wafer-processing equipment maker sells competing ALD, CVD and epitaxy deposition tools to the same logic and memory chipmakers ASM serves.

P/E: 53.8Score: 75Market cap: $388.12B

Lam's deposition line, built on the Novellus business, bids for the same CVD and ALD process steps in advanced logic and 3D NAND fabs.

Tokyo Electron Limited (東京エレクトロン株式会社)8035.T

Tokyo Electron competes head-on in single-wafer and batch ALD and in thermal processing furnaces, and is investing to take share in the ALD steps where ASM leads.

Kokusai Electric Corporation (株式会社Kokusai Electric)6525.T

Kokusai is the leader in batch ALD and vertical furnaces, the exact segment where ASM's furnace and batch deposition tools compete, above all at memory makers.

Wonik IPS Co., Ltd. (원익아이피에스)240810.KQ

The Korean toolmaker supplies ALD and PECVD deposition equipment qualified at Samsung and SK Hynix, competing with ASM for the same Korean memory budgets.

Jusung Engineering Co., Ltd. (주성엔지니어링)036930.KQ

Jusung specializes in ALD deposition tools sold to Korean DRAM makers, taking on ASM in the specific ALD steps of memory production.

貸借対照表と流動性

売上高

$3.34B

直近の公表四半期までの12か月 — 1株当たり指標からの推計

純利益

$1.07B

直近の公表四半期までの12か月 — 1株当たり指標からの推計

フリーキャッシュフロー

$235M

自己資本合計

$4.45B

負債合計

$71M

流動比率

2.17

利払い倍率

-

負債/EBITDA

0.06

一株当たり利益(EPS)

売上高と純利益

フリーキャッシュフロー

収益内訳

財務推移表

利益率の推移

負債の推移

負債の重さ

成長率グリッド

成長率 — 売上高

適正価値の推定

適正価値

適正価値

$713.28

現在株価

$828.20

安全マージン

-16.1%

適正価値レンジ

$463.63 - $962.92

推定方法

Analyst Target:$1113.26
DCF:$78.42
PE-based:$863.60
Graham Growth:$952.12
EPV:$111.37
アナリスト・コンセンサス:買い (20B / 4H / 1S)
直近の決算サプライズ:+15.23%

バリュエーション指標

P/E レシオ

37.61

ROE

26.8%

P/B レシオ

10.04

P/FCF

173.75

粗利益率

51.8%

ROIC

18.9%

収益性レーダー

Value Creation (Economic Moat)

ROIC

18.9%

WACC

17.1%

ROIC − WACC

+1.8 pp

ROIC exceeds the cost of capital — the company is creating value for shareholders.

ファンダメンタル分析基準

合格(14)

  • Price CAGR 33.67%
  • ROIC 18.9%
  • Gross Margin 51.8%
  • Debt/Equity ratio
  • Operating Margin 35.4%
  • Positive Free Cash Flow
  • Current Ratio
  • Debt/EBITDA
  • ROE 19.2%
  • Revenue Growth 5Y 19.0%
  • Analyst Consensus 80% Buy
  • Earnings Surprise avg 17.2%
  • PEG Ratio 1.98
  • Earnings Quality (OCF/NI) 1.36

不合格(7)

  • P/FCF 173.75
  • P/B Ratio 10.04
  • CapEx intensity
  • Price below Graham Number
  • DCF valuation (Overvalued)
  • Net Margin Trend 22.8% vs 23.4%
  • Piotroski F-Score 2/9

データなし(6)

  • EPS data insufficient
  • Dividend Payout NaN%
  • Interest Coverage
  • Return on Tangible Assets
  • Low reliance on intangibles
  • Share Dilution (missing shares data)

Piotroski F-スコア

2/9

重大な財務上の懸念

score
criteria

利益の質

1.36

高品質:利益はキャッシュに裏付けられている

株式希薄化

-

株式を買い戻している。株主に友好的

ガバナンス

経営陣

氏名役職年齢
Dr. Hichem M'SaadCEO & Chairman of the Management Board60
Mr. Paulus Antonius Henricus VerhagenCFO & Member of Management Board59
Mr. Hakan ErdemirSenior Vice President of Global Operations57
Mr. Victor BareñoDirector of Investor Relations-
Mr. Srini VedulaSenior Vice President of Global Sales53
Ms. Edyta JakubekSenior VP of Global People & Chief People Officer51
Gary DingChief Product Officer63
Paul MaCorporate VP, Head of Strategy and M&A49

監査リスク

1

取締役会リスク

1

報酬リスク

2

株主権利リスク

6

パート2 · 株価と買い時

この部分は企業に価値があるかを判断するものではありません。ファンダメンタルズに納得したうえで、いつ買うかを選ぶためのものです。内容:テクニカル分析、ポテンシャル、過去のドローダウン、ガンマエクスポージャー。

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